○ High precision metrology
○ Flexible product adaptation near customer
○ Best cost benefit ratio compared to competitors
○ Long term customer’s care and product support
| E+H Measuring sorting system |
|
|
|---|---|---|
| Technical Specifications |
|
|
| Wafer diameter |
|
300mm |
| Thickness range |
|
600-900µm |
| Max. Warp |
|
100µm |
| Resistivity range |
|
0.001-200Ohm•cm |
| Type check range |
|
0.020-200Ohm•cm |
| Thickness Measurement |
|
|
| Thickness absolute Accuracy |
|
+/-0.3µm |
| TTV Accuracy (MX 6012) |
|
+/-0.1µm |
| Precision (MX 6012) |
|
0.05µm（1 Sigma） |
| Resistivity Measurement |
|
|
| Accuracy | 0.001-80 Ω•cm | +/-1% |
|
|
80-200Ω•cm | +/-5% |
| Precision | 0.001-80Ω•cm | 0.2%（1 Sigma） |
|
|
80-200Ω•cm | 2%（1 Sigma） |
| Edge Exclusion |
|
|
| Thickness |
|
5 mm |
| Resistivity |
|
10 mm |
| Throughput (1 Point) |
|
> 150 Wafer/hour |
| Station |
|
12 |
1、Deviation of real value, average of repeated measurements are within these limits, at calibration temperature +/- 2 K, gradient < 1 K/h
2、Distance from sensor center to wafer edge
3、Depends on quality of calibration samples
